Automatic Solder Paste Printer for Industrial 4.0 MES System
Introduction
The Automatic Solder Paste Printing Machine represents top-tier equipment tailored for sophisticated SMT applications. It skillfully tackles the demanding printing needs of 03015 components and 0.25 pitch, ensuring unparalleled accuracy and swift performance.
Specification
| Model | G9+ |
| Max PCB Size | 450x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| Max board weight | 5kg |
| Transport height | 900±40mm |
| Board edge gap | 2.5mm |
| Board height | 15mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, program control |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/manual up-down table |
| PCB clamping system | Patented over the top clamping |
| Side clamping |
| Adsorption function |
| Print snap-off | 0-20mm |
| Print mode | one/twice |
| Print Speed | 10-200mm/sec |
| Print Mode | One /Twice |
| Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Print pressure | 0.5-10kg |
| Template fram size | 470*370mm~737*737mm(20-40thickness) |
| Cleaning System | Droops of rain type cleaning system |
| Reinforced vacuum absorption |
| Dry, wet vacuum three modes |
| Back and forth cleaning |
| CCD FOV | 10x8mm |
| Fiducial mark types | Standard Fiducial mark shape |
| Pad |
| Hole |
| Camera system | Look up/down optics structure |
| CCD digital camera |
| Geometry pattern match |
Machine Performance
| Model | G9+ |
| Repeat position accuracy | ±12.5um@6,CPK≥2.0 |
| Print accuracy | ±18um@6,CPK≥2.0 |
| Print cycle time | ＜7.5 sec |
| Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision |
Whole Machine Specification
| Power supply | AC:220±10%,50/60HZ, 3.0KW |
| Air pressure | 4~6 kgf/cm² |
| Air consumption | around 5L/min |
| Operating temperature | -20℃~+45℃ |
| Operating humidity | 30%~60% |
| Machine Dimensions(without tower light) | 1172(L) x 1385(W) x 1530 (H)mm |
| Machine Weight | Approx: around 1000Kg |
Features
This cutting-edge system incorporates an innovative optical path that delivers uniform circular illumination and bright coaxial lighting. Dual light sources provide infinite brightness adjustment, facilitating easy recognition of diverse and uneven mark points on various surfaces, including tin-plated, copper-plated, silver-plated materials, hot air-soldered items, FPC, and different PCB colors.
High-Precision PCB Thickness Adjustment Mechanism:
This mechanism features a robust structure with stable XY movement, enabling manual adjustment to seamlessly accommodate a broad range of PCB thicknesses.
Revolutionary Guide Rail Positioning System:
Designed to address FPC and PCB warpage, this system includes a detachable pattern guide rail and a programmable flexible side clamp. A unique clamping plate device ensures precise positioning, while software programming automates stretching and retraction to adapt to varying PCB thicknesses with ease.
Enhanced Squeegee Structure:
The squeegee structure boasts a comprehensive design that significantly improves stability and extends its lifespan.
Advanced High-Speed Stencil Cleaning Mechanism:
The downward dispensing cleaning structure effectively prevents stencil opening clogging, a prevalent issue in stencil cleaning processes. Software control allows for simple adjustment of the solvent dispensed length to achieve optimal cleaning results.
User-Friendly Multi-Function Interface:
Designed for simplicity and clarity, this intuitive interface offers real-time temperature and humidity monitoring, enabling users to effortlessly monitor and adjust conditions as needed.
About Us
Shenzhen HanSome Technology Co., Ltd. (HSTECH), founded in 2012, is led by a highly experienced engineer with a deep background in the EMS industry. Since its beginning, the company has specialized in developing and manufacturing PCB processing equipment, gradually expanding its portfolio to include PCB strippers and SMT cleaning machines. HSTECH is proud to have a skilled and ambitious R&D team that is constantly on the lookout for the latest industry technologies. This team is supported by a seasoned marketing group with a strong focus on exports, enabling HSTECH to stay ahead of market trends and ensure its products meet evolving customer needs.
Throughout its history, HSTECH has adhered to the principle of innovative development, achieving significant technological and product advancements. Our goal is to provide cost-effective solutions that empower our customers to increase productivity while minimizing costs and labor. We stand in solidarity with our customers, working together to create a brighter future.
HSTECH is committed to achieving "High Quality and Smartness," aligning with our "Quality-Oriented and Customer-Centric" philosophy. We incorporate industry-specific features and pursue smart technology to bring the vision of smart factories to life. In terms of after-sales service, we uphold the principle of "Responsibility," promptly addressing any quality feedback and consistently delivering exceptional service to our valued customers.
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Precision and Speed G9 Automatic Solder Paste Machine for 0.25 Pitch Components Images
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